NTU packs deal with STATS ChipPAC

Nanyang Technological University (NTU), rated the world’s second best university under 50 years old, has signed a collaborative partnership deal with semiconductor packing provider STATS ChipPAC.

Under the terms of the partnership, Singapore-based NTU will collaborate with ChipPAC on the acceleration of research into new materials and manufacturing processes in advanced semiconductor packaging technologies with an eye to commercialise.

Han Byung Joon, chief technology officer at STATS ChipPAC, said: “The semiconductor industry is evolving rapidly to meet the increasing device complexity and connectivity experience of today’s electronic consumers. We are constantly seeking to expand our technology and manufacturing innovations in order to deliver differentiated solutions for our customers’ next generation mobile convergence devices. We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices.”

Lim Jui, chief executive of NTU Innovation, added: “NTU continues to be the choice partner for industry leading companies, a key trait of a world-class, research-intensive university. NTU has an established track record in research and development with key industry players and through such partnerships, we turn fundamental research into innovation, leading to commercialisation. NTU’s collaboration with STATS ChipPAC provides a great opportunity for NTU faculty and post graduates to leverage on our strong research culture and expertise to develop advanced packaging solutions. By continuing to work in tandem with industry leaders such as STATS ChipPAC, we can continue to be an important engine for innovation in Singapore.”