Tovala cooks up $9.2m series A

Dec 20, 2017 •

Smart oven developer and University of Chicago spinout Tovala has been backed by UChicago Startup Investment Program in an Origin Ventures-led round.

Tovala, a US-based smart consumer appliance spinout from University of Chicago, has raised $9.2m in series A funding from a consortium that includes the university’s UChicago Startup Investment Program.

Venture capital firm Origin Ventures led the round, which also featured VC and private equity company Pritzker Group, and accelerator and VC firm Y Combinator along with angel investors Joe Mansueto and Larry Levy.

Tovala has created an automated oven that alternates between steam cooking, baking and broiling to cook food…

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