Every day, Global University Venturing rounds up the smaller investments from across the university innovation ecosystem in its deal net.
Arioso Systems, a Germany-based silicon micro-speaker chip developer spun out of Fraunhofer Institute for Photonic Microsystems IPMS, has attracted €2.6m ($2.8m) in an inaugural round backed by public-private investment fund High-Tech-Gründerfonds. Regional venture fund Brandenburg Capital led the round, which also included EU-backed regional program Technologiegründerfonds Sachsen and unnamed angel investors. Arioso Systems has devised a silicon chip intended to provide high-quality audio in wireless in-ear headsets. The chip will be fabricated using complementary-metal-oxide-semiconductor (Cmos) production, a technique already widely employed to manufacture micro-scale electromechanical systems.
