Every day, Global University Venturing rounds up the smaller investments from across the university innovation ecosystem in its deal net.
Bonx, a Japan-based online communication tool developer, has closed a ¥310m ($2.9m) series C round backed by Keio Innovation Initiative (KII), a joint venture capital vehicle for Keio University and securities brokerage Nomura Holdings, as well as IT services provider TIS, electronics producer Kaga Electronics, telecoms equipment maker Kanematsu Communications, VC firms Innovation Engine and Hack Ventures, and other investors including private individuals. Office equipment producer Ricoh injected $4m in July 2018 as part of a strategic partnership agreement. KII…
