Every day, Global University Venturing rounds up the smaller investments from across the university innovation ecosystem in its deal net.
Mlink, a China-based internet-of-things semiconductor technology developer backed by Tsinghua University, raised RMB100m ($15m) in a series B-plus round led by Beijing Integrated Circuit Chip Fund yesterday, according to DealStreetAsia. SIG Capital, Yangtze River Industry Fund, Enlight Growth Partners and Sichuan Entrepreneur Fund also took part in the round. The company secured a “similar-sized” series A-plus round in early 2020, according to the same report. DealStreetAsia identified TusStar, the incubator operated by Tsinghua University, as an existing backer. Other early…
Thierry Heles
Thierry Heles is editor-at-large of Global University Venturing and Global Corporate Venturing, and host of the Beyond the Breakthrough podcast.
