EPFL’s chip-link technology provider has added more than $36m to a Swisscom-backed round that now totals $92.3m, taking its total funding to almost $133m.
Kandou, a Switzerland-based chip-link technology spinout of EPFL, completed a $92.3m series C round that included telecommunications firm Swisscom on Tuesday.
New and existing investors including the Swiss Select Opportunities fund managed by Natixis Investment Managers’ Flexstone Partners subsidiary, and venture capital firms Bessemer Venture Partners (BVP) and Climb Ventures added $36.3m in new funding.
Swisscom’s Digital Transformation Fund and Swisscom Ventures units joined BVP, Columbia Lake Partners, Fayerweather Capital Partners, Forestay Capital, Kreos Capital, Raging Capital and Walden International in the round’s $56m first close in September 2019.
Formerly known as Kandou Bus, Kandou has developed chip-to-chip linking technology that enhances the performance of chip links while reducing the amount of energy they use. The series C proceeds will support the launch of a silicon retimer product called Matterhorn.
Amin Shokrollahi, founder and chief executive of Kandou, said: “This round of funding will enable us to meet growing customer demand for Matterhorn as we continue to innovate and deliver high-speed connectivity solutions.”
The company said the latest round brought its funding to nearly $133m since it was founded in 2011. BVP provided $15m in series A funding in 2016 before joining Walden International in a $15m series B round in mid-2018.
– A version of this article first appeared on our sister site, Global Corporate Venturing.
