Corporates get behind Oregon spin-out

Feb 21, 2014 •

Samsung, Intel, and Applied Materials all get behind latest round for Oregon State University semiconductor spin-out Inpria.

Inpria, an Oregon State University semiconductor materials developer spin-out, has received $4.7m of a $7.3m committed total from a trio of corporate venture capital units.

Intel Ventures, Samsung Venture Investment, and Applied Ventures, the respective venture units of computer chip manufacturer Intel, smartphone and electronics giant Samsung, and semiconductor firm Applied Materials, all participated in the round.

The cash will be going towards supporting the commercialisation of Inpria’s primary tech: a portfolio of photocondensed molecular oxides designed to support the…

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