Air Liquide, Samsung, Intel and Tokyo Ohka Kogyo have provided $10m for semiconductor photoresist maker Inpria, effectively doubling its total funding.
US-based semiconductor manufacturing technology producer Inpria Corporation closed a round led by industrial gas technology company Air Liquide on Tuesday that was sized at $10m, according to The Orgenian.
The round included Samsung Venture Investment Corporation and Intel Capital, respective subsidiaries of electronics producer Samsung and chipmaker Intel, and photolithography technology manufacturer Tokyo Ohka Kogyo.
Air Liquide participated through its strategic investment arm, Air Liquide Venture Capital.
Inpria supplies high-resolution photoresists for semiconductor manufacturing. It will use the funding to finish developing its metal oxide photoresists, and to scale manufacturing for the new product offering.
The round increased Inpria’s overall funding to about $20m. Samsung Venture Investment Corporation, Intel Capital, Oregon Angel Fund and Applied Ventures, the corporate venturing unit for semiconductor production equipment maker Applied Materials, participated in a $7.3m round in 2014.
Pierre-Etienne Franc, chief executive of Air Liquide Venture Capital, said: “We are delighted to take a minority stake in Inpria, an innovative technology startup developing a new platform of inorganic patterning materials for the semiconductor industry,”
Inpria was spun out of Oregon State University’s Department of Chemistry and Center for Sustainable Materials Chemistry in 2007.
– This article was first published on our sister site Global Corporate Venturing.
