China Life Private Equity Investment was among the investors in the Beijing Eswin subsidiary’s series B round, seven months after its reported series A.

China-based semiconductor technology developer Xi’an Eswin Silicon Wafer Technology raised RMB3bn ($464m) in series B funding on Friday from investors including insurer China Life’s Private Equity Investment unit.

Brokerage Citic Securities and its Goldstone Investment subsidiary co-led the round, which included Addor Capital, Beijing Singularity Power Investment Fund, China Internet Investment Fund, Shaanxi Private Fund, Triniti Capital and ZWC Partners.

Xi’an Eswin Silicon Wafer Technology was formed by chipmaker Beijing Eswin Technology Group in 2018 to produce integrated circuits…

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Edison Fu

Edison Fu is a reporter and Asia liaison at Global Corporate Venturing.
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