The semiconductor manufacturing component maker secured $23.5m, with Samsung Ventures, JSR Corporation, Aliad, Applied Ventures and Intel Capital all investing.
Inpria, a US-based semiconductor manufacturing technology spinout of Oregon State University (OSU), raised $23.5m on Monday in a series B round led by Samsung Ventures, a corporate venturing vehicle for electronics manufacturer Samsung.
The round included petrochemical materials provider JSR Corporation as well as Aliad, Applied Ventures and Intel Capital, respective subsidiaries of industrial gases supplier Air Liquide, semiconductor manufacturing technology provider Applied Materials and chipmaker Intel.
Founded in 2007, Inpria produces metal oxide photoresists, which are light-sensitive materials used for electronics manufacturing processes such as photolithography and photoengraving. The technology was developed at OSU’s Department of Chemistry and Center for Sustainable Materials Chemistry.
The funding will be used to complete construction and begin commercial production at Inpria’s test manufacturing facility. The company also intends to expand its workforce to meet a growing customer base.
Inpria has now secured approximately $43.5m in funding altogether. It raised $10m in a March 2016 round led by Air Liquide that included Samsung Venture Investment Corporation, Intel Capital and photolithography technology manufacturer Tokyo Ohka Kogyo.
Samsung Ventures, Intel Capital and Applied Ventures had previously participated in a $7.3m round for the company in 2014 alongside Oregon Angel Fund.
– A version of this article first appeared on our sister site Global Corporate Venturing.
